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1) Select the proper fuse size according to the available circuit space.
2) Select the proper fuse shape according to the mounting method of the circuit.
3) Select the proper fuse according to the product’s required
safety certification standards:
C-UL, VDE, SEMKO, PSE, CCC, KC, BSI.
4) Determine the proper fuse voltage rating according to the applied
voltage of the circuit.
5) Select the appropriate fuse current rating (In) according to the maximum normal
working current of the circuit.
- Considered the fuse decaying factors.
- Considered the derating of fuse based on the ambient temperature.
6) Consider the current pulse
- Calculate the circuit’s maximum current pulse I2t value.
- Calculate the required I2t value of fuse.
Time-lag fuse typically is recommended when distinctive current pulse is specified.
7) Select the fuse type.
8) Test run the selected fuse in the circuit/product.
Fuse Diameter | A(mm) | B(mm) |
---|---|---|
Φ3.0 | 5 | 52 |
Φ36 | 5.6 | 52 |
Φ4.6 | 10 | 52 |
Φ5.2 | 10 | 52 |
FUSE SIZE Type |
Φ3.6(mm) | Φ4.6(mm) | Φ5.2(mm) | ||||||
---|---|---|---|---|---|---|---|---|---|
A | B | C | A | B | C | A | B | C | |
AA | ≧2.5 | ≧6 | ≧5 | ≧3 | ≧6 | ≧5 | ≧3 | ≧6 | ≧5 |
AB | ≧16 | ≧15.4 | ≧3.5 | ≧20.5 | ≧20 | ≧3.5 | ≧26 | ≧25 | ≧4 |
AC | ≧16 | ≧11.5 | ≧7 | ≧20.5 | ≧16.5 | ≧7 | ≧26 | ≧21 | ≧6.5 |
AD | ≧6 | ≧3.5 | ≧6.5 | ≧6 | ≧5 | ≧6.5 | ≧6 | ≧5 | ≧6.5 |
AF | ≧6 | ≧3.5 | ≧5.5 | ≧6 | ≧5 | ≧5.5 | ≧6 | ≧5 | ≧5.5 |
AG | ≧4 | ≧3.5 | ≧5.5 | ≧4 | ≧5 | ≧5.5 | ≧4 | ≧5 | ≧5.5 |
Parameter | Conditions | Consent Standard |
---|---|---|
Short Time Over Load | Power=2.5*Pr ; T=25±2℃ ; t=5s | ± (1.0%+0.5mΩ) IEC60115-1 4.13 |
High Temp. Exposure | T=+155±2℃; t=1,000hrs |
± (1.0%+0.5mΩ) IEC60115-1 4.25 |
Low Temp. Load Life | T=-55±2℃; t=1,000hrs |
± (1.0%+0.5mΩ) IEC60115-1 4.25 |
Moisture Load Life | Vtest=Vmax,ton=90min, toff=30min, T=60±2℃,RH=95%,1,000hrs(with above) |
± (2.0%+0.5mΩ) IEC60115-1 4.25 |
Thermal Shock | [-55℃ 30min→ R.T. 3min→ +150℃ 30min→ R.T. 3min] by 100 Continuous Cycles |
± (1.0%+0.5mΩ) IEC60115-1 4.19 |
Load Life at 70℃ | Vtest=Vmax; T=70±2℃; t=90min On t=30min Off; 1,000hrs |
± (2.0%+0.5mΩ) IEC60115-1 4.25 |
Solderability | Dipped into Solder at 245±5℃ for 3±1s; | The covered area >95% IEC60115-1 4.17 |
Resistance to Solder Heat | 20±1s at 275±5℃ | ± (1.0%+0.5mΩ) IEC60115-1 4.18 |
Substrate Bending | Span Between Fulcrums: 90mm; Bend Width: 2mm; Test Board: Glass-Epoxy Board, Thickness=1.6mm by 10 continuous cycles |
± (0.5%+0.5mΩ) IEC60115-1 4.33 |
Mechanical Shock | a=100G for 11ms, 5 Pulse | ± (0.5%+0.5mΩ) IEC60115-1 4.21 |
Step 1:
Select the required resistance values for the circuit.
Step 2:
Choose resistance value of the most accuracy and minimal error of resistance.
Step 3:
Confirm the regular maximum current that flows into the component from the circuit.
Step 4:
Calculate the required minimum rated power of the component.The selected value must be higher than the actual value.
Step 5:
Select size according to available space on the component.
Step 6:
Consider the thermal electromotive force (EMF)
For Example:
A design engineer requires Current Sensing Resistors (CSR) to protect the rear end of the power source, and 5 m Ω is required on the circuit design. In addition, the applied power management IC is highly sensitivity and allows low resistance error, thus resistance precision lower than 1% should be opted. Furthermore, its regular current-flow is approximately 15 A, so the applicable resistor should endure a power (P) = 1.125W. The power supply space allocation is limited, so smaller sizes such as 1206 should be selected. Finally, this particular system does consider the EMF effect, therefore, HTC1206C2W0R005F is selected.